SuperMicro’s Next-Gen X13SWA-TF W790 Xeon/HEDT motherboard has been showcased up close

SuperMicro's Next-Gen X13SWA-TFW790 Xeon/HEDT motherboard has been showcased up close

Let’s have a closer look at Intel’s upcoming HEDT platform

More detailed images have immerged to showcase SuperMicro’s new X13SWA-TF W790 motherboard, an Intel Sapphire Rapids motherboards that will arrive as part of Intel’s planned 2023 HEDT (High-end Desktop) resurgence. An image of this motherboard has already been revealed online, but the image below is much more detailed, and it comes with a even more detailed specifications sheet.

This motherboard features an Intel LGA4677 socket and can support Sapphire Rapids processors with TDPs of up to 350 watts. This socket can support CPUs that feature up to 56 cores, and SuperMicro’s X13SWA-TF can support up to sixteen DDR5 modules across eight memory channels. With this motherboard, up to 2TB of memory can be supported through RDIMM 3DS DDR5 memory modules.

SuperMicro's Next-Gen X13SWA-TFW790 Xeon/HEDT motherboard has been showcased up close

With six PCIe 5.0 x16 slots and four PCIe 5.0 M.2 slots, SuperMicro’s X13SWA-TF W790 motherboard can support an obscene amount of I/O. Additionally, this motherboard also feature two U.2 slots, for those who own U.2 storage devices. This motherboard also features eight SATA ports for additional storage connectivity.

You can join the discussion on SuperMicro’s Sapphire Rapids X13SWA-TF motherboard on the OC3D Forums.

SuperMicro's Next-Gen X13SWA-TFW790 Xeon/HEDT motherboard has been showcased up close